View BSP75N08_270479.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Smart Lowside Power Switch
HITFET BSP 75N
Data Sheet Rev. 1.4 Features * * * * * * * * * Logic Level Input Input protection (ESD) Thermal shutdown with auto restart Overload protection Short circuit protection Overvoltage protection Current limitation Green Product (RoHS compliant) AEC Stress Test Qualification
Application * All kinds of resistive, inductive and capacitive loads in switching applications * C compatible power switch for 12 V and 24 V DC applications and for 42 Volt Powernet * Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET in Smart Power Technology. Fully protected by embedded protection functions. Type HITFET BSP 75N
Ordering Code on request
Package PG-SOT223-4
Product Summary Parameter Continuous drain source voltage On-state resistance Current limitation Nominal load current Clamping energy
Data Sheet Rev. 1.4 1
Symbol
Value 60 550 1 0.7 550
Unit V m A A mJ
2008-07-10
VDS RDS(ON) ID(lim) ID(Nom) EAS
HITFET BSP 75N
Vbb
HITFET Logic
Over voltage Protection
M
OUTPUT Stage DRAIN
IN
dV/dt limitation
ESD
Over temperature Protection
Short circuit Protection Current Limitation
SOURCE
Figure 1
Block Diagram
SOURCE
1 2 3
IN DRAIN SOURCE
Figure 2
Pin Configuration
Pin Definitions and Functions Pin No. 1 2 3 + TAB Symbol IN DRAIN SOURCE Function Input; activates output and supplies internal logic Output to the load Ground; pin3 and TAB are internally connected
Data Sheet Rev. 1.4
2
TAB
2008-07-10
HITFET BSP 75N
Circuit Description The BSP 75N is a monolithic power switch in Smart Power Technology (SPT) with a logic level input, an open drain DMOS output stage and integrated protection functions. It is designed for all kind of resistive and inductive loads (relays, solenoid) in automotive and industrial applications. Protection Functions * Over voltage protection: An internal clamp limits the output voltage at VDS(AZ) (min. 60V) when inductive loads are switched off. * Current limitation: By means of an internal current measurement the drain current is limited at ID(lim) (1.4 - 1.5 A typ.). If the current limitation is active the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. This operation leads to an increasing junction temperature until the over temperature threshold is reached. * Over temperature and short circuit protection: This protection is based on sensing the chip temperature. The location of the sensor ensures a fast and accurate junction temperature detection. Over temperature shutdown occurs at minimum 150 C. A hysteresis of typ. 10 K enables an automatic restart by cooling. The device is ESD protected according Human Body Model (4 kV) and load dump protected (see Maximum Ratings).
Data Sheet Rev. 1.4
3
2008-07-10
HITFET BSP 75N
Absolute Maximum Ratings Tj = 25 C, unless otherwise specified Parameter Continuous drain source voltage Drain source voltage for short circuit protection Continuous input voltage Peak input voltage Continuous Input Current -0.2V VIN 10V VIN<-0.2V or VIN>10V Operating temperature range Storage temperature range
1)
Symbol
Values 60 36
Unit Remarks V V - - - -
VDS VDS VIN VIN IIN
-0.2 ... +10 V -0.2 ... +20 V no limit | IIN | 2mA -40 ... +150 C -55 ... +150 C 1.8 550 W mJ V 80 47
mA -
Tj Tstg Power dissipation (DC) Ptot Unclamped single pulse inductive energy EAS
Load dump protection 2) IN = low or high (8 V); RL = 50 IN = high (8 V); RL = 22
- -
VLoadDump
ID(ISO) = 0.7 A; Vbb =32V VLoadDump = VP + VS; VP = 13.5 V RI3) = 2 ; td = 400 ms;
-
Electrostatic discharge voltage (Human Body Model) according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993
VESD
4000
V
Thermal Resistance Junction soldering point Junction - ambient4)
1) 2) 3) 4)
RthJS RthJA
10 70
K/W - K/W -
See also Figure 7 and Figure 10.
VLoadDump is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839. See also page 7. RI = internal resistance of the load dump test pulse generator LD200.
Device on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for pin 4 connection.
Data Sheet Rev. 1.4
4
2008-07-10
HITFET BSP 75N
Electrical Characteristics Tj = 25 C, unless otherwise specified Parameter Symbol Limit Values min. typ. max. Unit Test Conditions
Static Characteristics Drain source clamp voltage Off state drain current
VDS(AZ) 60 IDSS
-
- -
75 5
V A
Input threshold voltage
VIN(th) 1
1.8
2.5
V A
Input current: normal operation, ID < ID(lim): IIN(1) current limitation mode, ID = ID(lim): IIN(2) After thermal shutdown, ID = 0 A: IIN(3) On-state resistance
ID = 10 mA, Tj = -40 ... +150 C VIN = 0 V, VDS = 32 V, Tj = -40 ... +150 C ID = 10 mA VIN = 5 V
- 100 200 - 250 400 1000 1500 2000 - - 490 850 430 750 - 675 1350 550 1000 - m ID = 0.7 A, VIN = 5 V m ID = 0.7 A, VIN = 10 V A
Tj = 25 C Tj = 150 C
On-state resistance
RDS(on)
Tj = 25 C Tj = 150 C
Nominal load current
RDS(on)
- -
ID(Nom) 0.7
Current limit
ID(lim)
1
1.5
1.9
A
VBB = 12 V, VDS = 0.5 V, TS = 85 C, Tj < 150 C VIN = 10 V, VDS = 12 V
Dynamic Characteristics 1) Turn-on time
VIN to 90% ID: ton
-
10
20
s
Turn-off time
VIN to 10% ID: toff
-
10
20
s
RL = 22 , VIN = 0 to 10 V, VBB = 12 V RL = 22 , VIN = 10 to 0 V, VBB = 12 V
Data Sheet Rev. 1.4
5
2008-07-10
HITFET BSP 75N
Electrical Characteristics (cont'd) Tj = 25 C, unless otherwise specified Parameter Slew rate on Symbol Limit Values min. typ. 5 max. 10 V/ s V/ s Unit Test Conditions
70 to 50% VBB: -dVDS/ - dton 50 to 70% VBB: dVDS/ dtoff -
Slew rate off
10
15
RL = 22 , VIN = 0 to 10 V, VBB = 12 V RL = 22 , VIN = 10 to 0 V, VBB = 12 V
Protection Functions2) Thermal overload trip temperature Thermal hysteresis Tjt 150 - 550 200 165 10 - - 180 - - - C mJ - -
Tjt
Unclamped single pulse inductive EAS energy Tj = 25 C Tj = 150 C Inverse Diode Continuous source drain voltage
1) 2)
ID(ISO) = 0.7 A, VBB = 32 V
VSD
-
1
-
V
VIN = 0 V,
-ID = 2 x 0.7 A
See also Figure 9. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous, repetitive operation.
Data Sheet Rev. 1.4
6
2008-07-10
HITFET BSP 75N
EMC-Characteristics
The following EMC-Characteristics outline the behavior of typical devices. They are not part of any production test. Table 1 Parameter Temperature Supply Voltage Load Operation mode DUT specific Fast electrical transients acc. to ISO 7637 Test Result Test1) Pulse 1 2 3a 3b 4 5
1)
Test Conditions Symbol TA VS RL PWM DC Value 23 5 13.5 27 - - Unit C V - - Remark - - ohmic fINx=100Hz, D=0.5 ON / OFF
VIN('HIGH')=5V
Max. Test Level ON -200V +200V -200V +200V -7V 175V C C C C C
OUTx stressed OFF C C C C C E(75V)
Pulse Cycle Time and Generator Impedance 500ms ; 10 500ms ; 10 100ms ; 50 100ms ; 50 0.01 400ms ; 2
E(65V)
The test pulses are applied at VS
Definition of functional status Class C E Content All functions of the device are performed as designed after exposure to disturbance. One or more function of a device does not perform as designed after exposure and can not be returned to proper operation without repairing or replacing the device. The value after the character shows the limit.
Data Sheet Rev. 1.4
7
2008-07-10
HITFET BSP 75N
Conducted Susceptibility
VBB PULSE
Acc. 47A/658/CD IEC 62132-4 (Direct Power Injection)
RL
BSP75N IN DRAIN SOURCE
Direct Power Injection: Forward Power CW Failure Criteria: Amplitude or frequency variation max. 10% at OUT Typ. Vbb Susceptibility at DC-ON/OFF and at PWM
Figure 3
Test circuit for ISO pulse
40 35 30 25
Conducted Emissions
dBm
Acc. IEC 61967-4 (1/150 method) Typ. Vbb Emissions at PWM-mode with 150-matching network
100 90 80 70 60 50
Noise level BSP75N 150ohm Class6 150ohm Class1
20 15 10 5 0 1 10 100 1000
Limit OUT, ON OUT, OFF OUT, PWM
f / MHz
dBV
150 / 8-H
40 30 20 10 0 -10 -20 0,1 1 10 100 1000
VBB
150 / 13-N
BAN BSP75N RL
f / MHz
IN
DRAIN SOURCE HF
VBB
Test circuit for conducted susceptibility
BSP75N IN DRAIN SOURCE 150-Network
1)
RL
2)
2)
Figure 4
Test circuit for conducted emission 1)
8
For defined de coupling and high reproducibility a defined choke (5H at 1MHz) is inserted in the Vbb-Line. Broadband Artificial Network (short: BAN) consists of the same choke (5H at 1MHz) and the same 150 Ohm-matching network as for emission measurement for defined de coupling and high reproducibility.
Data Sheet Rev. 1.4
2008-07-10
HITFET BSP 75N
Block diagram
VBB
ID
uC Vcc BSP75N IN D SOURCE
IIN
HITFET IN DRAIN SOURCE VDS Vbb
Px.1 GND
VIN
Figure 8 Figure 5 Terms
Application Circuit
IN
SOURCE
Figure 6
Input Circuit (ESD protection)
ESD zener diodes are not designed for DC current.
LOAD
VAZ
Drain VDS
Power DMOS
Source ID
Figure 7
Inductive and Over voltage Output Clamp
Data Sheet Rev. 1.4
9
2008-07-10
HITFET BSP 75N
Timing diagrams
VIN
VIN t VDS t ID 0.9*ID 0.1*ID ton toff t
ID(lim) ID t j
t
thermal hysteresis
t
Figure 11
Short circuit
Figure 9
Switching a Resistive Load
VIN VDS(AZ) VDS VBB t ID t t
Figure 10
Switching an Inducitve Load
Data Sheet Rev. 1.4
10
2008-07-10
HITFET BSP 75N
1 Max. allowable power dissipation Ptot = f(TAmb)
2
2 On-state resistance RON = f(Tj); ID = 0.7 A; VIN = 10 V
1000
P
to t
R
ON
9 0 m0
1,6 W
800 700
m ax.
m a x.
1,2
600 500
typ .
0,8
400 300
0,4
200 100
0 0 25 50 75 1 00
0
C 125
15 0
-5 0 -2 5
0
25
50
C 75 100 125 150 T
j
T
Amb
3 On-state resistance RON = f(Tj); ID = 0.7 A; VIN = 5 V
14 00
4 Typ. input threshold voltage VIN(th) = f(Tj); ID = 10 mA; VDS = 12 V
2 ,5
R
ON
V
IN (th )
m 12 00
V2
10 00
typ .
m a x.
1 ,5
8 00
typ .
6 00
1
4 00
0 ,5
2 00
0 -50 -2 5 0 25 50
0
C 75 1 00 125 15 0 T
j
-5 0
-2 5
0
25
50
75
C 100 125 150 T
j
Data Sheet Rev. 1.4
11
2008-07-10
HITFET BSP 75N
5 Typ. on-state resistance RON = f(VIN); ID = 0.7 A; Tj = 25 C
2000
6 Typ. current limitation ID(lim) = f(Tj); VDS = 12 V, VIN = 10 V
2
R
ON
I D (lim )
1m0 0 5
typ .
A 1 ,5
typ .
1000
1
500
0 ,5
0 0 2 4 6
0
V 8
10
-5 0
-2 5
0
25
50
75
C 100 125 150 T
j
V
IN
7 Typ. short circuit current ID(SC) = f(VIN); VDS = 12 V, Tj = 25 C
2
8 Max. transient thermal impedance ZthJA = f(tp) @ 6cm; Parameter: D = tp/T
100
I D (S C )
typ . A 1 ,5
Z
th (J A )
1 K /W 0
1
D= 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 0
1
0 ,5
0 0 2 4 6
V 8
10
0 ,1
0 ,0 0 0 0 1 0 ,0 0 1 0 ,1 10
V
s 1000
IN
tP
100000
Data Sheet Rev. 1.4
12
2008-07-10
HITFET BSP 75N
Package Outlines HITFET BSP 75N
1
Package Outlines HITFET BSP 75N
6.5 0.2 3 0.1
4
A
1.60.1 0.1 MAX.
15 MAX.
B
3.5 0.2
1
2
3
7 0.3
0.7 0.1 4.6 0.25 M A
2.3
0.5 MIN.
0.28 0.04
0...10
0.25 M B
GPS05560
Figure 12
PG-SOT223-4 (Plastic Green Small Outline Transistor Package)
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Please specify the package needed (e.g. green package) when placing an order
You can find all of our packages, sorts of packing and others in our Infineon Internet Page: http://www.infineon.com/packages. Data Sheet 13
Dimensions in mm Rev. 1.4, 2008-07-10
HITFET BSP 75N
Revision History
2
Version
Revision History
Date Changes
Rev. 1.4 2008-07-10 fixed a formatting error in Disclaimer page Rev. 1.3 2008-04-14 package naming updated to PG-SOT223-4 Rev. 1.2 2007-04-12 released automotive green version changed package naming from -11 to PG-SOT223-4-7 Rev. 1.1 2007-03-28 Package parameter (humidity and climatic) removed in Maximum ratings AEC icon added RoHS icon added Green product (RoHS-compliant) added to the feature list Package information updated to green Green explanation added Rev. 1.0 2003-01-10 released production version
Data Sheet
14
Rev. 1.3, 2008-04-14
HITFET BSP 75N
Edition 2008-07-10 Published by Infineon Technologies AG, 81726 Munich, Germany
(c) Infineon Technologies AG 2008. All Rights Reserved.
Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet
15
2008-07-10

▲Up To Search▲

Price & Availability of BSP75N08

	To Download BSP75N08 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .